Difference between revisions of "OWG Meeting 28-Oct-2009"
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1:30 PM Wed 11-Nov-2009 | 1:30 PM Wed 11-Nov-2009 | ||
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| + | ==New Action Items from this Meeting== | ||
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| + | =Minutes= | ||
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| + | Attendees: Elliott W, Mark I, Chris, C, Ben R, Simon T, William G, Fernando B, Beni Z. | ||
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| − | ''' | + | '''ASIC and SiPM Update''' |
Fernando gave an update on the ASIC preamp and SiPM efforts. See GlueX docs 1364 (ASIC) and 1370 (SiPM). | Fernando gave an update on the ASIC preamp and SiPM efforts. See GlueX docs 1364 (ASIC) and 1370 (SiPM). | ||
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* Carl Zorn will perform extensive tests on all 10 SiPM's. | * Carl Zorn will perform extensive tests on all 10 SiPM's. | ||
* Gain about 10**6, noise ok. | * Gain about 10**6, noise ok. | ||
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| − | + | '''Electronics Update''' | |
| + | Chris gave an update on the remaining electronics efforts. | ||
| − | + | * All projects well defined and moving along according to schedule, manpower ok. | |
| − | + | * Version 2 of TDC and ADC coming up, serious work to begin by March 2010. | |
| − | + | * Work on global trigger boards (GTP, SSP) in progress. | |
| − | + | * TS board will be worked on in the next fiscal year, DAQ group heavily involved. | |
| + | * Chris is working on early VXS crate procurement for all halls, order perhaps in Spring 2010. | ||
Latest revision as of 09:13, 29 October 2009
Contents
Agenda
This will be a short meeting as we have interviews at 2:30pm
- Announcements -
- Review of minutes from 30-Sep-2009 meeting
- Electronics update - Fernando (he has another meeting at 2pm)
- Report on SSP - Ben
- Other electronics and trigger status reports - Chris, Ben, Ed, Alex, Dave
Time/Location
1:30 PM Wed 28-Oct-2009 CC F326
Announcements
Next Meeting
1:30 PM Wed 11-Nov-2009
New Action Items from this Meeting
Minutes
Attendees: Elliott W, Mark I, Chris, C, Ben R, Simon T, William G, Fernando B, Beni Z.
SSP Board Design
Ben gave a brief overview of progress on SSP board design.
- Front panel includes NIM and differential inputs.
- 8 fiber transceivers per board.
- CLAS will use a different version of the board, one SSP per sector.
- Board layout is preliminary, all major components placed, minor ones not placed yet.
- Firmware has been simulated.
ASIC and SiPM Update
Fernando gave an update on the ASIC preamp and SiPM efforts. See GlueX docs 1364 (ASIC) and 1370 (SiPM).
- ASIC and board ready for production, all features included (incl. dual gain).
- Boards pass all tests, look very good.
- Have 40 new ASICS with correct wire bonding plus old ones with faulty bond.
- Need 2000 for final system.
- Hamamatsu has delivered 10 4x4 SiPM arrays (1.2 cm square), still waiting for SensL (deadline early Nov).
- Ceramic carrier, no cooling needed, but temperature stabilization needed.
- 81% coverage, SensL will be slightly less.
- 50 micron pixels.
- Initial testing very good, meets all specs, cost in our range.
- Large SiPM array capacitance is typically high, not much can be done about it.
- Get 13 ns risetime for 5 ns input, 76 ns width.
- Carl Zorn will perform extensive tests on all 10 SiPM's.
- Gain about 10**6, noise ok.
Electronics Update
Chris gave an update on the remaining electronics efforts.
- All projects well defined and moving along according to schedule, manpower ok.
- Version 2 of TDC and ADC coming up, serious work to begin by March 2010.
- Work on global trigger boards (GTP, SSP) in progress.
- TS board will be worked on in the next fiscal year, DAQ group heavily involved.
- Chris is working on early VXS crate procurement for all halls, order perhaps in Spring 2010.
