Difference between revisions of "OWG Meeting 28-Oct-2009"
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1:30 PM Wed 11-Nov-2009 | 1:30 PM Wed 11-Nov-2009 | ||
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| + | '''SSP Board Design''' | ||
| + | |||
| + | Ben gave a brief overview of progress on SSP board design. | ||
| + | |||
| + | * Front panel includes NIM and differential inputs. | ||
| + | * 8 fiber transceivers per board. | ||
| + | * CLAS will use a different version of the board, one SSP per sector. | ||
| + | * Board layout is preliminary, all major components placed, minor ones not placed yet. | ||
| + | * Firmware has been simulated. | ||
| + | |||
| + | |||
| + | '''Electronics Update''' | ||
| + | |||
| + | Fernando gave an update on the ASIC preamp and SiPM efforts. See GlueX docs 1364 (ASIC) and 1370 (SiPM). | ||
| + | |||
| + | * ASIC and board ready for production, all features included (incl. dual gain). | ||
| + | * Boards pass all tests, look very good. | ||
| + | * Have 40 new ASICS with correct wire bonding plus old ones with faulty bond. | ||
| + | * Need 2000 for final system. | ||
| + | * Hamamatsu has delivered 10 4x4 SiPM arrays (1.2 cm square), still waiting for SensL (deadline early Nov). | ||
| + | * Ceramic carrier, no cooling needed, but temperature stabilization needed. | ||
| + | * 81% coverage, SensL will be slightly less. | ||
| + | * 50 micron pixels. | ||
| + | * Initial testing very good, meets all specs, cost in our range. | ||
| + | * Large SiPM array capacitance is typically high, not much can be done about it. | ||
| + | * Get 13 ns risetime for 5 ns input, 76 ns width. | ||
| + | * Carl Zorn will perform extensive tests on all 10 SiPM's. | ||
| + | * Gain about 10**6, noise ok. | ||
| + | * | ||
| + | * | ||
Revision as of 16:35, 28 October 2009
Contents
Agenda
This will be a short meeting as we have interviews at 2:30pm
- Announcements -
- Review of minutes from 30-Sep-2009 meeting
- Electronics update - Fernando (he has another meeting at 2pm)
- Report on SSP - Ben
- Other electronics and trigger status reports - Chris, Ben, Ed, Alex, Dave
Time/Location
1:30 PM Wed 28-Oct-2009 CC F326
Announcements
Next Meeting
1:30 PM Wed 11-Nov-2009
SSP Board Design
Ben gave a brief overview of progress on SSP board design.
- Front panel includes NIM and differential inputs.
- 8 fiber transceivers per board.
- CLAS will use a different version of the board, one SSP per sector.
- Board layout is preliminary, all major components placed, minor ones not placed yet.
- Firmware has been simulated.
Electronics Update
Fernando gave an update on the ASIC preamp and SiPM efforts. See GlueX docs 1364 (ASIC) and 1370 (SiPM).
- ASIC and board ready for production, all features included (incl. dual gain).
- Boards pass all tests, look very good.
- Have 40 new ASICS with correct wire bonding plus old ones with faulty bond.
- Need 2000 for final system.
- Hamamatsu has delivered 10 4x4 SiPM arrays (1.2 cm square), still waiting for SensL (deadline early Nov).
- Ceramic carrier, no cooling needed, but temperature stabilization needed.
- 81% coverage, SensL will be slightly less.
- 50 micron pixels.
- Initial testing very good, meets all specs, cost in our range.
- Large SiPM array capacitance is typically high, not much can be done about it.
- Get 13 ns risetime for 5 ns input, 76 ns width.
- Carl Zorn will perform extensive tests on all 10 SiPM's.
- Gain about 10**6, noise ok.
New Action Items from this Meeting
Minutes
Attendees: Elliott W, Mark I, Chris, C, Ben R, Simon T, William G, Fernando B, Beni Z.
