Minutes-6-23-2016
June 23, 2016 Transition Radiation Detector meeting
Recent TRD reports at the GlueX collaboration meeting
Prototype: requirements and very preliminary design
- Requirements:
- Use existing FDC pre-amps, fADC125, connectors, cables
- Wires and strips at 90 deg.;
- One 24-channel pre-amp for the wires and one pre-amp for the strips.
- Active area sizes:
- 240 mm across wire direction: sense wire pitch of 10 mm
- 120 mm across strip direction: strip pitch of 5 mm.
- Field wires in between sense wires with 10 mm pitch.
- 20 mm drift gap
- Max drift time < 3 microseconds (to be used within the standard GlueX DAQ):
- +2kV on sense wires, -500V on field wires, -1.4kV on the upstream cathode, downstream cathode (with strips) on ground Garfield field/drift time simulations
- Adding additional cathode separates the drift and amplification volume and allows to set independently drift velocity and gas gain Garfield simulations, track example
- Xe/CO2 70/30 gas
- Upstream cathode made of aluminized Mylar - critical to minimized keV-photon absorption
- Radiator in front up to 150 mm thick - good to have it in a separate gas volume flushed with CO2, also to keep the upstream cathode flat and insulated.
- Detector schematic
- Brian's design
Minutes
Participants: Eugene, Drew Weisenberg, Brian Kross, Sergey, Yulia Furletova and Lubomir (JLab).
- Eugene and Drew agreed that the detector group (Brian and others) will build the detector. Brian will need help for the PCB design and manufacturing from Chris Cuevas and Fernando's people.
- Lubomir went through the requirements above explaining the main features of the detectors. Sergey commented on the radiator. The main difference w.r.t. the spare FDC package will be that we will apply negative HV on the entrance cathode made out of thin aliminized Kapton.
- The preliminary designs are attached above - 5 (or 6) planes made out of g10 (Aluminum for the radiator box) - cathode strip plane, wire plane, second cathode plane with wires, drift box and radiator box.
- The plan is to finish the mechanical design by end of July, then work on the PCBs by the end of August, then start assembly in September to be ready for the Fall run.
