OWG meeting 18-Apr-2008

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Agenda

  • Announcements
  • Review of minutes from 11-Apr-2008 meeting
  • CODA3 components and progress related to subsystem review - Graham
  • [More on event size study] - Alex S.
  • Status of writing assignments and other preparations for subsystem review - many people
  • Electronics - Status of documentation - Fernando


Time/Location

Note special time - 10am Fri 18-Apr-2008 CC F326

Due to scheduling problems, this will be a joint meeting with the Electronics group.


Announcements

Subsystem review will be Wed,Thurs 7,8-May. GlueX collaboration meeting scheduled for the end of that week.

Information concerning the charge, agenda, dry run schedule, etc. can be found on the May 2008 Subsystem Review page.


Elke's Deadlines

  • Final presentations to Elke: 5-May close-of-business
  • Pre-brief material to reviewers: 30-April
  • Pre-brief material to Hall-D group to read: 23-April
  • Pre-brief outlines: 11-April


Next Meeting

May not happen due to dry runs


New Action Items from this Meeting

Minutes

Attendees: Elliott W, Ben R, Dave A, Simon T, Beni Z, Dave D, Time W, Chris C, Eugene C, Mark I, David L, Graham H, Ed J, Carl T, Vardan G, Elke A, Elton S, Hai D, Alex S, Jim S, Fernando B.


May Subsystem Review


CODA3 and EMU Design

Graham outlined the CODA 3 architecture and the discussed role of the Event Management Unit (EMU).


Update on Event Rate/Size Study

Alex gave an update from his report last week. See link above for many details.

  • Considered signal plus EM and hadronic backgrounds.
  • EM using 100 ns gate, 1.1 MeV photon cutoff.
  • Used simple cuts. Original CNU cuts tuned w/o EM background so not very effective, need updating.
  • EM 78% have no ST signal, hadr 98% have ST signal.
  • 93% overall hadr efficience w/Alex's cuts.
  • 82 kHz EM plus 98 kHz hadr = 180 kHz total L1 trigger rate with Alex's cuts.
  • This work adequate for May review.


Electronics Update

  • A lot of background material for pre-brief can be found on the Electronics page.
  • Information on grounding in preparation.
  • Overview document coming.