Difference between revisions of "Minutes 9-6-2006"
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| − | 1). Brian has produced a new end view drawing of the FDC. His plan | + | 1). Mechanical Drawings: |
| + | Brian has produced a new end view drawing of the FDC. His plan | ||
is next to add traces, connectors, and bolt holes to the | is next to add traces, connectors, and bolt holes to the | ||
individual planes. | individual planes. | ||
| − | 2). Brian brought a 1-cm thick sample of Rohacell to show us. This | + | 2). Rohacell: |
| + | - Brian brought a 1-cm thick sample of Rohacell to show us. This | ||
material can be machined to a very high degree of flatness. The | material can be machined to a very high degree of flatness. The | ||
Rohacell thickness between the cathode and ground planes is | Rohacell thickness between the cathode and ground planes is | ||
nominally 5-mm. | nominally 5-mm. | ||
| − | + | - Brian told us his plan is not to mount the Rohacell to a frame. | |
| − | + | ||
He believes that this is not necessary. From Brian's conversations | He believes that this is not necessary. From Brian's conversations | ||
with Youri Sharabian, Rohacell is gas tight. | with Youri Sharabian, Rohacell is gas tight. | ||
| − | + | 3). Paperwork: | |
| + | The PR for the full-scale tensioning system has finally been | ||
signed. | signed. | ||
| − | + | 4). Mechanical Mockup of Cathode Sandwich: | |
| + | Brian will start work on a full-scale mock-up of the Rohacell | ||
sandwich. If kapton is not available, then mylar will be used. | sandwich. If kapton is not available, then mylar will be used. | ||
The Rohacell order should arrive in ~2 weeks. | The Rohacell order should arrive in ~2 weeks. | ||
| − | + | 5). Wire Winding: | |
| + | - Brian talked to Karen Kephart of FNAL. It seems as if the wire | ||
winding shop will be available to ~2010. | winding shop will be available to ~2010. | ||
| − | + | - Brian discussed a neat wire deadening system used by Karen. | |
| − | + | ||
The wires are embedded in a copper solution to build up their | The wires are embedded in a copper solution to build up their | ||
radii to a specified level -- this kills the gain in an elegant | radii to a specified level -- this kills the gain in an elegant | ||
manner. | manner. | ||
| − | + | 6). Design Discussion: | |
| + | - DSC asked whether circuit boards can be made with a Rohacell | ||
dielectric -- Brian will look into this but the issue could | dielectric -- Brian will look into this but the issue could | ||
be local flatness. | be local flatness. | ||
| − | + | - Brian will look into PC board manufacturers who can make 1.2 m | |
| − | + | ||
circuit boards to our specs. | circuit boards to our specs. | ||
| + | - Brian will show DSC the small-scale tensioning system in the | ||
| + | EEL building this week. We need to plan on how to make a | ||
| + | chamber stack. | ||
| − | + | 7). Monte Carlo: | |
| − | + | - Simon needs to do Monte Carlo to specify the allowable Rohacell | |
| − | + | and epoxy thicknesses. | |
| − | + | - Note that there is no need to epoxy Rohacell to the ground planes | |
| − | + | in the active region. Epoxy only at external edges and possible | |
| − | + | the center point. | |
| − | + | - Could this work for the cathode planes as well? Some tensioning | |
| − | + | might be required. | |
| − | + | ||
| − | + | ||
| − | + | ||
| − | + | 8). Cathode Sandwich Discussion: | |
| − | + | DSC again raised the idea not to tension the cathode planes | |
| − | + | but to work on a flat surface instead and roll the plane | |
| + | flat. | ||
Minutes prepared by Daniel. Send any comments or corrections along. | Minutes prepared by Daniel. Send any comments or corrections along. | ||
Revision as of 09:37, 13 December 2006
FDC Weekly Meeting
Date: September 6, 2006
Participants: Daniel, Brian, Simon
Next Meeting: Wednesday, September 13, 2006 @ 1:30 p.m.
1). Mechanical Drawings:
Brian has produced a new end view drawing of the FDC. His plan is next to add traces, connectors, and bolt holes to the individual planes.
2). Rohacell:
- Brian brought a 1-cm thick sample of Rohacell to show us. This material can be machined to a very high degree of flatness. The Rohacell thickness between the cathode and ground planes is nominally 5-mm. - Brian told us his plan is not to mount the Rohacell to a frame. He believes that this is not necessary. From Brian's conversations with Youri Sharabian, Rohacell is gas tight.
3). Paperwork:
The PR for the full-scale tensioning system has finally been signed.
4). Mechanical Mockup of Cathode Sandwich:
Brian will start work on a full-scale mock-up of the Rohacell sandwich. If kapton is not available, then mylar will be used. The Rohacell order should arrive in ~2 weeks.
5). Wire Winding:
- Brian talked to Karen Kephart of FNAL. It seems as if the wire winding shop will be available to ~2010. - Brian discussed a neat wire deadening system used by Karen. The wires are embedded in a copper solution to build up their radii to a specified level -- this kills the gain in an elegant manner.
6). Design Discussion:
- DSC asked whether circuit boards can be made with a Rohacell dielectric -- Brian will look into this but the issue could be local flatness. - Brian will look into PC board manufacturers who can make 1.2 m circuit boards to our specs. - Brian will show DSC the small-scale tensioning system in the EEL building this week. We need to plan on how to make a chamber stack.
7). Monte Carlo:
- Simon needs to do Monte Carlo to specify the allowable Rohacell and epoxy thicknesses. - Note that there is no need to epoxy Rohacell to the ground planes in the active region. Epoxy only at external edges and possible the center point. - Could this work for the cathode planes as well? Some tensioning might be required.
8). Cathode Sandwich Discussion:
DSC again raised the idea not to tension the cathode planes but to work on a flat surface instead and roll the plane flat.
Minutes prepared by Daniel. Send any comments or corrections along.
