Difference between revisions of "Minutes 10-4-2006"
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| − | 1). Brian reported that the materials for the full-scale cathode | + | 1). Full-Scale Tensioning System: |
| + | - Brian reported that the materials for the full-scale cathode | ||
tensioning system have arrived. He will ask the shop to construct | tensioning system have arrived. He will ask the shop to construct | ||
the device once we are ready. | the device once we are ready. | ||
| Line 15: | Line 16: | ||
latest mechanical drawing. | latest mechanical drawing. | ||
| − | 2). The wire circuit board will consist of circuit board tiles laminated | + | 2). Wire Plane Circuit Board: |
| + | - The wire circuit board will consist of circuit board tiles laminated | ||
on a g10 backing. Brian (and Chris Cuevas) believe that this will | on a g10 backing. Brian (and Chris Cuevas) believe that this will | ||
give us the most flexibility in choosing a vendor and will not | give us the most flexibility in choosing a vendor and will not | ||
give us any problems in precision as dowel pins will be used to | give us any problems in precision as dowel pins will be used to | ||
define the relative positioning. | define the relative positioning. | ||
| − | + | - Brian has continued to work on the mechanical design and the wire | |
| − | + | ||
plane design. | plane design. | ||
| − | + | - The wire plane circuit board will be divided into a signal side | |
| − | + | and a HV side. | |
| − | + | - The current design consists of a frame with a 3 in (approx) | |
| − | + | annulus ==> 103 sense wires, 104 field wires. | |
| − | + | 3). Rohacell Order: | |
| + | The Rohacell order finally is signed and out the door. | ||
| − | + | 4). Mechanical Drawings: | |
| + | Brian believes his mechanical drawings are nearly far enough along | ||
to give to the Electronics Group for design. DSC believes that | to give to the Electronics Group for design. DSC believes that | ||
we should not rush this forward. We need to work on such areas | we should not rush this forward. We need to work on such areas | ||
| Line 36: | Line 39: | ||
number of design iterations. | number of design iterations. | ||
| − | + | 5). Cooling System: | |
| + | We need to think about the on-chamber cooling system for the | ||
electronics. | electronics. | ||
| − | + | 6). Mechanical Design: | |
| + | We discussed how to attach the FDC layers within a package. | ||
Currently we have ~48 ``threaded rods". This is necessary to | Currently we have ~48 ``threaded rods". This is necessary to | ||
compress the o-rings. DSC asked Brian to consider a ``quick" | compress the o-rings. DSC asked Brian to consider a ``quick" | ||
| Line 45: | Line 50: | ||
suggested a cam-type securing bolt that could be easily released. | suggested a cam-type securing bolt that could be easily released. | ||
| − | + | 7). Monte Carlo Update: | |
| + | Simon reported that HDFast is really broken. DSC asked Simon if | ||
he could use an old version. Simon will look into this. | he could use an old version. Simon will look into this. | ||
| − | + | 8). Copper Thickness: | |
| + | It is not clear what copper thickness we have on our flex boards | ||
for the cathodes. 1/4 oz vs. 1/2 oz? Brian and Simon will look | for the cathodes. 1/4 oz vs. 1/2 oz? Brian and Simon will look | ||
into this (check the order form that Randy Wojcik put together). | into this (check the order form that Randy Wojcik put together). | ||
| − | + | 9). Schedule: | |
| + | Meet in two weeks after the GlueX Collaboration meeting. | ||
Minutes prepared by Daniel. Send any comments or corrections along. | Minutes prepared by Daniel. Send any comments or corrections along. | ||
Revision as of 09:31, 13 December 2006
FDC Weekly Meeting
Date: October 4, 2006
Participants: Daniel, Brian, Simon
Next Meeting: Wednesday, October 18, 2006 @ 1:30 p.m.
1). Full-Scale Tensioning System:
- Brian reported that the materials for the full-scale cathode tensioning system have arrived. He will ask the shop to construct the device once we are ready. - Brian asked that we verify that the largest possible diameter of the active cathode area is 1.2 m. We verified this from Ravi's latest mechanical drawing.
2). Wire Plane Circuit Board:
- The wire circuit board will consist of circuit board tiles laminated on a g10 backing. Brian (and Chris Cuevas) believe that this will give us the most flexibility in choosing a vendor and will not give us any problems in precision as dowel pins will be used to define the relative positioning. - Brian has continued to work on the mechanical design and the wire plane design. - The wire plane circuit board will be divided into a signal side and a HV side. - The current design consists of a frame with a 3 in (approx) annulus ==> 103 sense wires, 104 field wires.
3). Rohacell Order:
The Rohacell order finally is signed and out the door.
4). Mechanical Drawings:
Brian believes his mechanical drawings are nearly far enough along to give to the Electronics Group for design. DSC believes that we should not rush this forward. We need to work on such areas as the gas distribution design for the chambers to reduce the number of design iterations.
5). Cooling System:
We need to think about the on-chamber cooling system for the electronics.
6). Mechanical Design:
We discussed how to attach the FDC layers within a package. Currently we have ~48 ``threaded rods". This is necessary to compress the o-rings. DSC asked Brian to consider a ``quick" disconnect system to enable access to the chamber faster. Brian suggested a cam-type securing bolt that could be easily released.
7). Monte Carlo Update:
Simon reported that HDFast is really broken. DSC asked Simon if he could use an old version. Simon will look into this.
8). Copper Thickness:
It is not clear what copper thickness we have on our flex boards for the cathodes. 1/4 oz vs. 1/2 oz? Brian and Simon will look into this (check the order form that Randy Wojcik put together).
9). Schedule:
Meet in two weeks after the GlueX Collaboration meeting.
Minutes prepared by Daniel. Send any comments or corrections along.
