Difference between revisions of "Minutes-3-3-2011"

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== Electronics ==
 
== Electronics ==
  
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- The answer from Allflex regarding the first article inspection is linked above. Bill suggested using better (printer) paper for packing. Roger will contact Allflex to coordinate the rate of the production. They will have to re-adjust their equipment every time they switch to the production of our cathodes. Most likely we will not be able to inspect the foils with the same rate. Therefore we will do only partial inspection during the acceptance and 100% inspection later whenever possible before the use of the foils. We may use summer students for this inspection.  
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- As of now Allflex plans to produce one set (three panels) per week starting 03/25/11. Eugene: the rate is too low and it will take almost two years. Bill: we would like to have 3 sets per week. We may use students for the foil inspection. We will ask Allflex to increase the production rate.
  
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- Interesting discussion about the solder type (see the above link), but without Fernando we didn't make decisions. Important features of the solder: how reactive (corrosive) is it, wire diameter, how easy is to clean the flux. Bill: no-clean solder means also difficult to clean. Roger: there were some issues with no-clean solder for some applications at the accelerator and they decided not to use it. Paste vs wire: flux fully evaporates when using wire; paste can create solder balls. Bill: the wires will be covered during soldering. We will do more investigations but the best is to used something proven to work. We will ask UVA for a solder roll they have used for the Hall A chambers, it turned out they had several rolls remaining, although the wire diameter is bigger than what we want. After the meeting Beni found the Japanese company (http://www.almit.co.jp/eng/product/sold.html#pb) that made the UVA solder, but they no longer produce the exact same solder type.
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- Chris is working on the PR for the rigid-flex stuffing. We want to have all the flexes (615) populated.  
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- Beni/Bill contacted the Japanese company (http://www.almit.co.jp/eng/product/sold.html#pb) that made the UVA solder. They 
  
 
== Engineering ==
 
== Engineering ==

Revision as of 18:53, 3 March 2011

March 3, 2011 FDC meeting

Agenda

  1. Production
    • Blue Crab status (David)
    • Readiness review program (Beni, Dave, Bill)
  2. Electronics (Fernando, Roger)
  3. Engineering (Bill, David)
    • New mounting template
    • Other
  4. Chamber testing
    • "Upside-down" tests (Lubomir)
  5. Other


Minutes

Participants: Bill, Dave, Simon, Chris, Glenn, Eugene, Beni, and Lubomir.

Production

- Dave: There was safety walk-through at Blue Crab; no issues. All the tables needed are inside the clean room except the stringing table. A test PCB ring was glued using old boards and Bill is happy with it. Important is to fill the gaps at the joints where the O-ring is positioned to avoid gas leakage. Test were made with the conductive epoxy we got from CMU and it worked well. So we will use this epoxy to connect the cathode to the ground plane. Will need ~20g (~$80) per plane. Next to be done: checking cathode frame height and the depth of the O-ring grooves.

- Beni created a web page (linked above) for the readiness review. The first part contains a checklist for the review. Eugene commented on the recovery procedures that they have to be in parallel with the acceptance tests. Beni: since we can't anticipate all the problems there must be also a common part explaining in general what we should do in case of unexpected problems. Lubomir: regarding the package assembling and package testing we don't have clear procedures yet. The testing will depend on the results from the first new design chamber. The idea is to build first one chamber with two end windows, to mount it to empty cathode/spacer frames as if it is in the package and to test it. Eugene: the review will be for the production only up to the point of the package assembling. Later we will add the documents for the rest of the procedures.


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