Difference between revisions of "Minutes-2-9-2012"
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= Minutes = | = Minutes = | ||
| − | Participants: Bill, Dave | + | Participants: Bill, Dave, Chris, Mark, Simon, Beni, and Lubomir. |
== Production == | == Production == | ||
| − | - Dave: wire boards #20 and #21 | + | - Dave: wire boards #20 and #21 waiting for electroplating. #22 will be populated soon by Chris. The problem on #23 was fixed (see pictures attached): |
| + | the signal trace on wire #96 had short to ground on the side of the PCB close to the via. The frame was drilled on the back side through the G10 and Rohacell to reach the board, the trace was disconne signal trace (#96) has short to ground most likely in the via or on the trace on the back side of the board. The plan is first to drill the via and confirm the problem is there. Then we will make an opening in the frame to access the trace on the back side of the board, fortunately there's Rohacell on the back of the via, not solid G10. Then we will solder insulated wire to make the connection. Cathode #33 was glued to the frame with some offset of ~3mm at most. One frame hole covers a trace on the connector; it can be fixed in principal but also the offset is not acceptable (Simon). So we have enough spare material to replace this cathode and will use it only if needed. Wire frame #13 (with the capacitor traces de-laminated) was inspected by EEFAB people. They said it can be fixed in two days, however later they claimed they need a $26K machine for that and want to share the costs; Dave will negotiate with them | ||
- Another sample using the original electroplating recipe was made with the hope the surface will be smoother. Waiting for the microscope pictures from Olga to make a decision whether we can continue with the wire deadening: two wire planes ready and waiting for this decision. | - Another sample using the original electroplating recipe was made with the hope the surface will be smoother. Waiting for the microscope pictures from Olga to make a decision whether we can continue with the wire deadening: two wire planes ready and waiting for this decision. | ||
Revision as of 17:03, 9 February 2012
February 9, 2012 FDC meeting
Agenda
- Production update Construction Tracking (Dave)
- Third package status
- Electroplating results
- First package testing FDC ELOG (Beni, Lubomir)
- Engineering update (Bill)
- Electronics update (Chris)
- Other
