Difference between revisions of "Minutes-2-24-2011"
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- We will have a readiness review in a month from now. Dave and Bill will work on the procedures/travelers/QA documents that are needed for the review. Beni will set up a page with the agenda, similar to that for the CDC review, where we will link all the documents. According to Eugene the review will be more technical than administrative. | - We will have a readiness review in a month from now. Dave and Bill will work on the procedures/travelers/QA documents that are needed for the review. Beni will set up a page with the agenda, similar to that for the CDC review, where we will link all the documents. According to Eugene the review will be more technical than administrative. | ||
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== Electronics == | == Electronics == | ||
| − | - The answer from Allflex regarding the first article inspection is linked above. Bill suggested using better ( | + | - The answer from Allflex regarding the first article inspection is linked above. Bill suggested using better (printer) paper for packing. Roger will contact Allflex to coordinate the rate of the production. They will have to re-adjust their equipment every time they switch to the production of our cathodes. Most likely we will not be able to inspect the foils with the same rate. Therefore we will do only partial inspection during the acceptance and 100% inspection later whenever possible before the use of the foils. We may use summer students for this inspection. |
| − | - | + | - Interesting discussion about the solder type, but without Fernando we didn't make decisions. Important features of the solder: how reactive (corrosive) is it, wire diameter, how easy is to clean the flux. Bill: no-clean solder means also difficult to clean. Roger: there were some issues with no-clean solder for some applications at the accelerator and they decided not to use it. Paste vs wire: flux fully evaporates when using wire; paste can create solder balls. Bill: the wires will be covered during soldering. We will do more investigations. In the mean time we will ask UVA for a solder roll. |
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Revision as of 19:37, 24 February 2011
February 24, 2011 FDC meeting
Contents
Agenda
- Production (David)
- Blue Crab status
- Readiness review
- Electronics (Fernando, Roger)
- Foil production: Allflex responce
- Other: solder for wires
- Engineering (Bill, David, Lubomir)
- Lessons learned from the test wire plane FDC Log Book, page 552
- Other: epoxy
- Chamber testing
- Tests with the middle chamber (Lubomir)
- Other
Minutes
Participants: Eugene, Bill, Dave, Roger, Simon, Beni, and Lubomir.
Production
- Dave: everything moved to Blue Crab (stringing table was moved there right after the meeting). We have there office with computers connected to network. Preparing for the PCB gluing. There was a problem with the lights there again. Bill regarding the stringing table: the pin rail was modified at the machine shop, ready together with the other parts to be mounted on the table at Blue Crab.
- We will have a readiness review in a month from now. Dave and Bill will work on the procedures/travelers/QA documents that are needed for the review. Beni will set up a page with the agenda, similar to that for the CDC review, where we will link all the documents. According to Eugene the review will be more technical than administrative.
Electronics
- The answer from Allflex regarding the first article inspection is linked above. Bill suggested using better (printer) paper for packing. Roger will contact Allflex to coordinate the rate of the production. They will have to re-adjust their equipment every time they switch to the production of our cathodes. Most likely we will not be able to inspect the foils with the same rate. Therefore we will do only partial inspection during the acceptance and 100% inspection later whenever possible before the use of the foils. We may use summer students for this inspection.
- Interesting discussion about the solder type, but without Fernando we didn't make decisions. Important features of the solder: how reactive (corrosive) is it, wire diameter, how easy is to clean the flux. Bill: no-clean solder means also difficult to clean. Roger: there were some issues with no-clean solder for some applications at the accelerator and they decided not to use it. Paste vs wire: flux fully evaporates when using wire; paste can create solder balls. Bill: the wires will be covered during soldering. We will do more investigations. In the mean time we will ask UVA for a solder roll.
