Revision as of 16:13, 2 February 2012

February 2, 2012 FDC meeting

Agenda

Production update Construction Tracking (Dave)
- Third package status
- Electroplating results
- Plans for the second package
First package testing (Lubomir, Beni)
Engineering update (Bill)
- Cooling system
- Other: HV connector position
Electronics update (Chris)
Other: once more naming convention

@@ Line 18: / Line 18: @@
 = Minutes =
-Participants: Bill, Dave, Chris, Nick, Mark, Simon, Beni, and Lubomir.
+Participants: Bill, Dave, Beni, Chris, Simon, Mark, Eugene, and Lubomir.
 == Production ==
-- Dave: wire board #20 (first cell of the 3rd package) is ready for wire deadening; waiting for the microscope results from Olga to make sure the new timing/currents for electroplating is OK. Wire board #21 ready for tension measurements, wire board #22 ready for stringing, wire board #23 was laminated. Cathodes: the two type-3 two tyoe-1 and one type-2 ready.
+- Dave: wire boards #20 and #21 ready waiting just for electroplating.
 - Casey is modifying the frame to install the second package on the rotational brackets (taken from the first package, see discussions later). After the second package is moved the tooling needed for the third package will be installed in the testing room. It includes 14 hubs and three metal pins to be taken from package #2. Package number #2 will remain with three metal pins and plastic rods only.