Difference between revisions of "Minutes-2-10-2011"

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(Production)
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- The thickness of the rigid board of the rigid-flex assemblies was modified according to Roger's e-mail, but Bill found in the actual file that it was not. Roger was not there to clarify. Lubomir will contact Roger also regarding the foil production status.  
 
- The thickness of the rigid board of the rigid-flex assemblies was modified according to Roger's e-mail, but Bill found in the actual file that it was not. Roger was not there to clarify. Lubomir will contact Roger also regarding the foil production status.  
  
- Bill and Dave had questions to Fernando about the solder to be used for the wires. Two solder types were used for the test wire plane: the solder recommended by Fernando and the solder paste used to tin the cathode contacts.
+
- Bill and Dave had questions to Fernando about the solder to be used for the wires. Two solder types were used for the test wire plane: the solder recommended by Fernando and the solder paste used to tin the cathode contacts. It was easier to work with the later, while the use of the first one resulted in too thick solder layer. Fernando doesn't recommend the solder paste: corrosive and also more difficult to clean the flux. Fernando and Chris will look for a thinner solder wire. 
  
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== Engineering ==
 
== Engineering ==
  
- Bill is working on some additional parts for the stringing system. The techs have been working with it last couple of weeks exercising different techniques. We discussed again the main issue so far, the flatness of the wire frame. Bill suggested using clamps that will be inserted between the G10 frame and the Rochacell ring. Fernando suggested a possible way to push the wire frame down from a supporting frame on the top. The way it works now is by taping the wires down to the board close to the soldering pads. This was proven to work: increase of the wire position deviations from ~10 microns to ~15 microns (sigma). Taping of all the wires is almost done and soon we will continue with gluing and soldering the wires.
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- Bill is working on several modifications of the stringing system:
 
+
* a protector cover for the wires needed during the soldering;      
- The testing of the "cheap" conductive epoxy was not very successful so far, it has high resistivity. Eugene: it might be better instead of spending time on improving the gluing technology, to use the "expensive" epoxy. Bill: the expensive epoxy has high viscosity and increases the thickness of the connections.      
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== Full-scale prototype tests ==
 
== Full-scale prototype tests ==
  

Revision as of 19:28, 10 February 2011

February 10, 2011 FDC meeting

Agenda

  1. Production (David)
    • Blue Crab status
  2. Electronics (Fernando, Chris, Roger)
    • Rigid-flex assemblies
    • Foil production status
    • Other
  3. Engineering (Bill, David, Lubomir)
  4. Full-scale prototype studies (Lubomir)
  5. Other


Minutes

Participants: Bill, Tina, Dave, Chris, Simon, Beni, Fernando, Eugene, Mark, Casey, Mike, and Lubomir. Tina Mann is our new FDC technician.

Production

- Dave: 80% of the staff was moved to Blue Crab. Remaining are the stringing system and the Lazy Susan table. All the stuff will be cleaned before moving inside the clean room. There were again power problems at Blue Crab. As a result all the systems for the clean room went off and were reset later.

- Next steps at Blue Crab: gluing and laminating PCBs to the wire frame, then cutting/gluing foils and building cathodes. We need the expertise of Mark and Brian. Dave will make approximate schedule for these operations so that we can ask for their help ahead of the time. Bill: not sure what is the best glue for the lamination.

Electronics

- The thickness of the rigid board of the rigid-flex assemblies was modified according to Roger's e-mail, but Bill found in the actual file that it was not. Roger was not there to clarify. Lubomir will contact Roger also regarding the foil production status.

- Bill and Dave had questions to Fernando about the solder to be used for the wires. Two solder types were used for the test wire plane: the solder recommended by Fernando and the solder paste used to tin the cathode contacts. It was easier to work with the later, while the use of the first one resulted in too thick solder layer. Fernando doesn't recommend the solder paste: corrosive and also more difficult to clean the flux. Fernando and Chris will look for a thinner solder wire.

Engineering

- Bill is working on several modifications of the stringing system:

  • a protector cover for the wires needed during the soldering;