Difference between revisions of "Minutes-11-7-2013"
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== Engineering == | == Engineering == | ||
| − | - Thickness of the packages: the thickness used so far | + | - Thickness of the packages: the thickness of a cell used so far in the simulation and data analyses was 2.1254 cm. By comparing the angles reconstructed from the Indiana chambers to those from the FDC, Lubomir estimated the thickness should be 2.15 +/- 0.1 cm (for the third package). This created some confusion that the nominal value may differ from the measured one due to the thickness of the glue on the cathodes that is not well controllable. However the problem was solved when Bill looked at the recent I-deas model and found the value there's 2.145 cm (after the meeting, xml file attached). He calculated also from the model the thickness of the full package: 14.42 cm and compared it to the results of the gusset flatness survey (attached) which gives 14.43 cmm for the first package: in a very good agreement. Bill is going to look at the other packages too. |
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== Electronics == | == Electronics == | ||
Revision as of 18:53, 7 November 2013
November 7, 2013 FDC meeting
Agenda
- Installation status[1]
- Engineering (Bill)
- FDC survey full flatness results, package thickness in the model
- Cooling system
- Electronics (Chris, Nick)
- Other
