Difference between revisions of "Jan 27, 2011 SiPM Electrical and Cooling"
From GlueXWiki
m (Text replacement - "http://argus.phys.uregina.ca/cgi-bin/private" to "https://halldweb.jlab.org/doc-private") |
|||
| (4 intermediate revisions by one other user not shown) | |||
| Line 2: | Line 2: | ||
* [http://www.jlab.org/~elton Files for discussion] | * [http://www.jlab.org/~elton Files for discussion] | ||
| − | * [ | + | * [https://halldweb.jlab.org/doc-private/DocDB/ShowDocument?docid=1663 Hall D BCAL Readout Mechanical Concept] (Jim Fochtman) |
== Action Items from previous meetings == | == Action Items from previous meetings == | ||
| − | # Develop a specification sheet for the readout electrical and cooling system (Elton) | + | # <strike> Develop a specification sheet for the readout electrical and cooling system (Elton) </strike> |
# Run his cooling model simulation for the situation when the electronics was turned off (Jim) | # Run his cooling model simulation for the situation when the electronics was turned off (Jim) | ||
| − | # Develop goals for mechanical prototype (Chuck and Jim) | + | # <strike> Develop goals for mechanical prototype (Chuck and Jim) </strike> |
== Tentative Agenda == | == Tentative Agenda == | ||
| − | # | + | # Announcements |
| + | # Schedule and reporting (Elton) | ||
# [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | # [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | ||
# Mechanical cooling (Jim) | # Mechanical cooling (Jim) | ||
| Line 21: | Line 22: | ||
== Minutes == | == Minutes == | ||
| − | ''Attendees: | + | ''Attendees: Jim, Carl, Jack, Fernando, Yi, Elton |
| + | |||
| + | # Announcements | ||
| + | # Schedule and reporting (Elton) | ||
| + | ## Reviewed EVMS reporting xcel file with small updates | ||
| + | ## Reviewed preliminary specification sheet. | ||
| + | ##* Signal cables are RG58 with LEMO connectors. (Elton suggested RG174 pigtails to bring out to patch panel) | ||
| + | ##* Power connectors not defined. However, each wedge would have +/- 5 V(?) and 4 bias leads, so about 6 inputs. | ||
| + | # [[Test Setup for SiPMs | First article testing]] (Carl and Yi) | ||
| + | #* Carl has checked more recent Hamamatsu arrays. A 3x3 cell has dark rate ~ 1 MHz, compared to 4-5MHz on previous samples | ||
| + | #* New PC is being installed for testing in ARC 628 | ||
| + | #* The front end for testing is labview, but John is providing a backend interface to KAMAX for ease of displays. | ||
| + | #* Yi is beginning to automate the system. He will be ordering electronics to accomplish this. | ||
| + | # Mechanical cooling (Jim) | ||
| + | #* [https://halldweb.jlab.org/doc-private/DocDB/ShowDocument?docid=1663 Gluex-doc-1663] of calculations for removing the heat from the electronic boards using air flow. | ||
| + | #* This results in very high flow rates: 1600 cfm for 1deg C temp rise of air, and 80 cmf for 20 deg C temp rise of air. | ||
| + | #* Concept for prototype box described. | ||
| + | # Temperature compensation (Jack) | ||
| + | #* Calculations of passive compensation system are very promising, indicating that system can be kept within a +/-2% gain change. This system should dissipate about 0.8 W (20mW/ch). | ||
| + | # Cooling Mechanical (Suggestion by Fernando) | ||
| + | #* A new idea was floated by Fernando, which is very appealing: | ||
| + | #* Interchange the location of the temp comp and pream/sum boards, i.e. the temp comp board would but up against the cooling plate | ||
| + | #* Feed the SiPM pins though the cooling plate and the temp comp board to the preamp/sum board. | ||
| + | #* Place a layer of Sil pad between the preamp/sum board and a metal heat spreader. The heat spreader could be used to collect the dissipated heat and this could be cooled with a secondary cooling loop or simply cooled by conduction to the outside. | ||
| + | #* Jim will take a look at this and review possibilities. | ||
| + | # Preamp-summing (Fernando) | ||
| + | #* Requested updated table of Npe for dynamic range | ||
| + | #* Gain of 16-cell preamp board for testing has a gain of about 64 | ||
| + | # Discussion | ||
| + | #* Elton requested slides from Jack, Jim and Fernando so they could be included into his presentation at the next [[GlueX-Collaboration-Jan-2011]]. | ||
Latest revision as of 17:07, 24 February 2017
Contents
Background information
- Files for discussion
- Hall D BCAL Readout Mechanical Concept (Jim Fochtman)
Action Items from previous meetings
-
Develop a specification sheet for the readout electrical and cooling system (Elton) - Run his cooling model simulation for the situation when the electronics was turned off (Jim)
-
Develop goals for mechanical prototype (Chuck and Jim)
Tentative Agenda
- Announcements
- Schedule and reporting (Elton)
- First article testing (Carl and Yi)
- Mechanical cooling (Jim)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
- Discussion
Minutes
Attendees: Jim, Carl, Jack, Fernando, Yi, Elton
- Announcements
- Schedule and reporting (Elton)
- Reviewed EVMS reporting xcel file with small updates
- Reviewed preliminary specification sheet.
- Signal cables are RG58 with LEMO connectors. (Elton suggested RG174 pigtails to bring out to patch panel)
- Power connectors not defined. However, each wedge would have +/- 5 V(?) and 4 bias leads, so about 6 inputs.
- First article testing (Carl and Yi)
- Carl has checked more recent Hamamatsu arrays. A 3x3 cell has dark rate ~ 1 MHz, compared to 4-5MHz on previous samples
- New PC is being installed for testing in ARC 628
- The front end for testing is labview, but John is providing a backend interface to KAMAX for ease of displays.
- Yi is beginning to automate the system. He will be ordering electronics to accomplish this.
- Mechanical cooling (Jim)
- Gluex-doc-1663 of calculations for removing the heat from the electronic boards using air flow.
- This results in very high flow rates: 1600 cfm for 1deg C temp rise of air, and 80 cmf for 20 deg C temp rise of air.
- Concept for prototype box described.
- Temperature compensation (Jack)
- Calculations of passive compensation system are very promising, indicating that system can be kept within a +/-2% gain change. This system should dissipate about 0.8 W (20mW/ch).
- Cooling Mechanical (Suggestion by Fernando)
- A new idea was floated by Fernando, which is very appealing:
- Interchange the location of the temp comp and pream/sum boards, i.e. the temp comp board would but up against the cooling plate
- Feed the SiPM pins though the cooling plate and the temp comp board to the preamp/sum board.
- Place a layer of Sil pad between the preamp/sum board and a metal heat spreader. The heat spreader could be used to collect the dissipated heat and this could be cooled with a secondary cooling loop or simply cooled by conduction to the outside.
- Jim will take a look at this and review possibilities.
- Preamp-summing (Fernando)
- Requested updated table of Npe for dynamic range
- Gain of 16-cell preamp board for testing has a gain of about 64
- Discussion
- Elton requested slides from Jack, Jim and Fernando so they could be included into his presentation at the next GlueX-Collaboration-Jan-2011.
