Difference between revisions of "FDC Construction Details"
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These documents contain all steps involved to build the wire frame including the steps after stringing: | These documents contain all steps involved to build the wire frame including the steps after stringing: | ||
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P012.pdf D000000103P012] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P012.pdf D000000103P012] FDC WIREPLANE PCB FITTING AND GLUING |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P013.pdf D000000103P013] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P013.pdf D000000103P013] FDC WIREPLANE PCB GAS BLOCK ATTACHMENT |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P015.pdf D000000103P015] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P015.pdf D000000103P015] FDC WIREPLANE LAMINATE THE G10/ROHACELL RING TO PCB |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P018.pdf D000000103P018] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P018.pdf D000000103P018] FDC WIREPLANE CLEAN FOR ENTRY INTO CLEANROOM |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P020.pdf D000000103P020] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P020.pdf D000000103P020] FDC WIREPLANE ATTACH TO STRONGBACK AND WIRING PREP |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P024.pdf D000000103P024] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P024.pdf D000000103P024] FDC WIREPLANE SCAN WIRE POSITIONS |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P025.pdf D000000103P025] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P025.pdf D000000103P025] FDC WIREPLANE APPLY EPOXY RING AND FIX WIRE |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P026.pdf D000000103P026] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P026.pdf D000000103P026] FDC WIREPLANE SOLDER WIRES |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P027.pdf D000000103P027] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P027.pdf D000000103P027] FDC WIREPLANE FREQUENCY TO TENSION MEASUREMENT |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P029.pdf D000000103P029] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D00000-01-03-P029.pdf D000000103P029] FDC WIREPLANE INSPECT AND INITIAL ELECTRICAL TEST OF BOARD |
| − | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P035.pdf D000000103P035] | + | [http://www.jlab.org/Hall-D/reviews_material/FDC_Readiness_Review_Mar_31_2011/Pre-Brief%20Materials/Procedures/D000000103P035.pdf D000000103P035] FDC WIREPLANE LAMINATION INSPECTION |
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Revision as of 18:13, 30 March 2011
Contents
The GlueX FDC
Overview
Construction
Details of the FDC Construction
Global documents
Wire Plane Construction
These documents contain all steps involved to build the wire frame including the steps after stringing:
D000000103P012 FDC WIREPLANE PCB FITTING AND GLUING
D000000103P013 FDC WIREPLANE PCB GAS BLOCK ATTACHMENT
D000000103P015 FDC WIREPLANE LAMINATE THE G10/ROHACELL RING TO PCB
D000000103P018 FDC WIREPLANE CLEAN FOR ENTRY INTO CLEANROOM
D000000103P020 FDC WIREPLANE ATTACH TO STRONGBACK AND WIRING PREP
D000000103P024 FDC WIREPLANE SCAN WIRE POSITIONS
D000000103P025 FDC WIREPLANE APPLY EPOXY RING AND FIX WIRE
D000000103P026 FDC WIREPLANE SOLDER WIRES
D000000103P027 FDC WIREPLANE FREQUENCY TO TENSION MEASUREMENT
D000000103P029 FDC WIREPLANE INSPECT AND INITIAL ELECTRICAL TEST OF BOARD
D000000103P035 FDC WIREPLANE LAMINATION INSPECTION
Cathode/Ground Plane Construction
These documents contain all steps in the fabrication of the cathode foil and ground planes, gluing onto the cathode frame, and soldering rigid-flex assemblies:
Stack Assembly
These documents contain all steps involved to assemble the FDC package (not yet ready).
