Difference between revisions of "Feb 5,2013 Readout"
From GlueXWiki
(→Tentative Agenda) |
(→Tentative Agenda) |
||
Line 28: | Line 28: | ||
# [[GlueX-Collaboration-Feb-2013|Collaboration Meeting]] | # [[GlueX-Collaboration-Feb-2013|Collaboration Meeting]] | ||
# Review of Action Items | # Review of Action Items | ||
− | # Simulations: '''Decision: nominal or coarse outer layer subdivision for sampling fraction simulations''' | + | # Simulations: |
+ | #* '''Decision: nominal or coarse outer layer subdivision for sampling fraction simulations''' | ||
# Monitoring | # Monitoring | ||
# Update from USM | # Update from USM |
Revision as of 09:51, 5 February 2013
Teleconference Time: 11:00 a.m. EST
- ESNET (Number is 8542553) and EVO session (GlueX Calorimetry meeting room)
- Phone connection only upon request.
- +1-866-740-1260 : US and Canada
- +1-303-248-0285 : International
- then use participant code: 3421244# (the # is needed when using the phone)
- OR from www.readytalk.com type access code 3421244 into "join a meeting" without the # (you need java plugin)
Contents
Participant Direct Lines
- JLab Phone: in CC F326 is 757-269-6460 (usual room)
- JLab Phone in CC L207 is 757-269-7084
- Phone in the Regina Videoconference Suite is 306-585-4204
- Athens Phone: in Christina's office is 011-30-210-727-6947
Items for followup from previous meeting
- SiPMs
- Recent photos of 17 scratched SiPMs will be uploaded to the data base.
- Simulation
- David to verify thresholds used in the sampling study and consider practical input/output of data including possible interpolation.
Presentations from recent meetings
Tentative Agenda
- Announcements
- Collaboration Meeting
- Review of Action Items
- Simulations:
- Decision: nominal or coarse outer layer subdivision for sampling fraction simulations
- Monitoring
- Update from USM
- Provide analysis and proposal of what to do about the scratched SiPMs
- Update from JLab
- Electronics (from Fernando)
- The remaining activities for the readout tests are under the electronics.
- 80% of the boards have been tested and are ready for assembly into modules once we receive the mechanical parts; the remaining 20% of the boards are awaiting new resistors (one per SiPM) due to the SiPM grouping.
- All boards are likely to be ready within the next two weeks.
- Status of gluing light guides
- GlueX-doc-2131 First look at production modules
- Electronics (from Fernando)
- Status of testing at Regina
- Beam Tests, Cosmics
- Other
Minutes
Attending: