Difference between revisions of "May 12, 2011 SiPM Electrical and Cooling"
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# Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | # Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories. | ||
− | # Check bowing with FEA | + | # <strike> Check bowing with FEA </strike> |
# PCB dummy power load for thermal test. | # PCB dummy power load for thermal test. | ||
Line 22: | Line 22: | ||
== Minutes == | == Minutes == | ||
− | ''Attending: | + | ''Attending: Chuck, Jim, Elton, Carl, Jack, Yi, Chris |
+ | |||
+ | # Announcements | ||
+ | #* No meeting next week. | ||
+ | # Action Items | ||
+ | # Schedule, reporting, and manpower (Elton) | ||
+ | #* No updates to schedule | ||
+ | # SiPM testing (Carl and Yi) | ||
+ | #* Carl has received comments to draft report. Will incorporate with figures from Yi and send to Thomas Bailey tomorrow afternoon in time for his trip to Japan. | ||
+ | #* Ten samples each for Regina and USM have been remeasured. Minor discrepancies were discovered compared to previous measurements, but these can be explained due to incomplete warm up. | ||
+ | #* Given the data, the HV can be tuned on the samples to achieve better matching. | ||
+ | # Mechanical (Jim) | ||
+ | #* Considerable discussion on tolerances and datum for the sensors. | ||
+ | #* Eugene suggested a new idea of adding a (permanent) block to the bottom of the SiPM, which would be used to reference the sensor. This could be screwed into the cooling plate | ||
+ | #* Jim with Carl's help will measure the sensor packages with an eye toward actual tolerances, and consider the use of the cooling plate as the datum. | ||
+ | #* Light guide molds: Rough estimate for the 40 guide glass mold could be about $30k. Jim will talk to engineer and find out if we can get examples of molds to check surface quality. Likely the molds would be made for only a tower at a time (i.e. 10 guides) | ||
+ | # Mechanical drawings (Chuck) | ||
+ | # Geometry (Elton) | ||
+ | # Temperature compensation (Jack) | ||
+ | #* Prototype boards (3 amps, one sum and bias compensation circuit) have been made. One has been populated. Minor changes are required, but can be accommodated for the tests. | ||
+ | #* Thermal test box should be completed by the end of the month. | ||
+ | # Preamp-summing (Fernando) |
Latest revision as of 18:37, 12 May 2011
References
Action Items from previous meetings
- Check impact of material at low end of readout, both in the tubes for cooling fluid but also in the Cu cooling plate. Need to check effect on particle trajectories.
-
Check bowing with FEA - PCB dummy power load for thermal test.
Tentative Agenda
- Announcements
- Action Items
- Schedule, reporting, and manpower (Elton)
- SiPM testing (Carl and Yi)
- Mechanical (Jim)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Preamp-summing (Fernando)
Minutes
Attending: Chuck, Jim, Elton, Carl, Jack, Yi, Chris
- Announcements
- No meeting next week.
- Action Items
- Schedule, reporting, and manpower (Elton)
- No updates to schedule
- SiPM testing (Carl and Yi)
- Carl has received comments to draft report. Will incorporate with figures from Yi and send to Thomas Bailey tomorrow afternoon in time for his trip to Japan.
- Ten samples each for Regina and USM have been remeasured. Minor discrepancies were discovered compared to previous measurements, but these can be explained due to incomplete warm up.
- Given the data, the HV can be tuned on the samples to achieve better matching.
- Mechanical (Jim)
- Considerable discussion on tolerances and datum for the sensors.
- Eugene suggested a new idea of adding a (permanent) block to the bottom of the SiPM, which would be used to reference the sensor. This could be screwed into the cooling plate
- Jim with Carl's help will measure the sensor packages with an eye toward actual tolerances, and consider the use of the cooling plate as the datum.
- Light guide molds: Rough estimate for the 40 guide glass mold could be about $30k. Jim will talk to engineer and find out if we can get examples of molds to check surface quality. Likely the molds would be made for only a tower at a time (i.e. 10 guides)
- Mechanical drawings (Chuck)
- Geometry (Elton)
- Temperature compensation (Jack)
- Prototype boards (3 amps, one sum and bias compensation circuit) have been made. One has been populated. Minor changes are required, but can be accommodated for the tests.
- Thermal test box should be completed by the end of the month.
- Preamp-summing (Fernando)